Would you recommend (if you have the proper tools and know-how) taking apart a new Air and putting thermal compound on the second portion of the cpu?
I've seen a lot of tests about what the best way to apply thermal paste for most heat transfer-ability, and it seems like the less-is-better model has the best effect. I've noticed in repairing a lot of Apple laptops, that they just gob the thermal compound on to the point where it's overflowing out the sides of the processor. So I'd probably redo the thermal compound anyway, might as well put some on the rest of the processor. That would only help right?
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Would you recommend (if you have the proper tools and know-how) taking apart a new Air and putting thermal compound on the second portion of the cpu?
I've seen a lot of tests about what the best way to apply thermal paste for most heat transfer-ability, and it seems like the less-is-better model has the best effect. I've noticed in repairing a lot of Apple laptops, that they just gob the thermal compound on to the point where it's overflowing out the sides of the processor. So I'd probably redo the thermal compound anyway, might as well put some on the rest of the processor. That would only help right?