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iPhone de 4 pulgadas lanzado en marzo de 2016 con especificaciones de hardware similares al 6s. Disponible en Plata, Gris espacial, Oro u Oro rosa con opciones de almacenamiento de 16/64 GB. Modelos A1662 y A1723.

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What other IC Chips cannot be separated?

I know that on an iPhone several IC Chips cannot be separated and need to stay together for the iPhone to function properly and if you were to replace any of them they need to be reprogrammed which not may people can do. I know that on the iPhone SE the Apple A9, Qualcomm MDM9625M, and the Toshiba NAND Flash are tied together and can't be separated. Are there any other chips that are also tied together with these?

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Generally speaking, recent iPhone designs have the CPU, NAND, Baseband and EEPROM tied together. If you are wondering about eliminating iCloud Lock, for example, then all of these IC's have to be replaced together (that plus the Home Button to retain Touch ID). Very few people can successfully do CPU replacements. It is a very risky procedure and is not really cost effective IMO, certainly not for an iPhone SE.

Let me know if there is a specific use case you are considering or if it is just general knowledge.

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Thank you for your answer. Yes, I have a water damaged iPhone SE motherboard that has no Icloud lock. I removed the shields from it and cleaned it with rubbing alcohol. It's still not working though. Soon I will buy a rework station and get into micro soldering and I want to buy an Icloud locked iPhone SE off ebay. I am aware that it is a very difficult task, but I have tons of boards and stuff that I can practice on before I do this.


I couldn't find much for the eeprom chip. Could you show me where it is located?

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There is the anti-Rollback EEPROM (U0900) and the Baseband EEPROM (U_EEP_RF). I am not certain which one of the two has to be replaced (or both) as this is not a repair I have invested any time in.

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Is there any updates on where these two EEPROM chips are located?

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