Traduciendo paso 13
Paso 13
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E pluribus unum. Here are the many chips that make up the One:
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Samsung K3QF7F70DM-QGCF 3 GB LPDDR3 RAM; Qualcomm Snapdragon 801 likely layered beneath
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Qualcomm WCD9320 Audio Codec
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AGD2 2402 WX9DR (likely gyroscope)
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Qualcomm PM8941 and PM8841 Power Management ICs Quick Charge 2.0 capable
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8407 CEH 05KTJ
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B02419
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P0911 3193
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