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Smontaggio iPhone 12 Pro Max

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iPhone 12 Pro Max Teardown: paso 0, imagen 1 de 3 iPhone 12 Pro Max Teardown: paso 0, imagen 2 de 3 iPhone 12 Pro Max Teardown: paso 0, imagen 3 de 3

  • Fair warning, there were some minor casualties in today's board delamination. A little slip of the knife at 300° C is all it took to smear some of these chips right off the board. We blame our robot intern. Here are some of the bits he managed to salvage:

  • 128 GB of Kioxia NAND flash memory

  • STMicroelectronics STB601A power management IC

  • Qualcomm's SDR865 5G and LTE transceiver, SDX55M 5G modem-RF system, and SMR526 intermediate frequency IC

  • USI 339S00761 WLAN / Bluetooth module

  • Avago 8200 high/mid-band power amplifier with integrated duplexer

  • Murata 1XR-482 mmWave front-end module

  • Looking for that sweet, sweet A14 chip with 6 GB of layered memory? Keep reading for a detailed look at the rest of the board.

Avvertimento, ci sono delle piccole vittime nella delaminazione della scheda di oggi. Una piccola sbavatura con il coltello a 300°C è tutto quello che è bastato per "cavare" via dalla scheda alcuni di questi chip. Diamo la colpa al nostro robot tirocinante. Ecco alcuni dei pezzi che è riuscito a salvare:

Memoria flash NAND Kioxia da 128 GB

IC gestione alimentazione ST Microelectronics STB601A

Ricetrasmettitore 5G e LTE Qualcomm SDR865, Sistema Modem-RF 5G SDX55M e IC frequenza intermedia SMR526

Modulo Bluetooth / WLAN USI 339S00761

Amplificatore banda alta/media Avago 8200 con duplexer integrato

Modulo front-end mmWave Murata 1XR-482

Cerchi quel dolcissimo chip A14 stratificato su più di 6 GB di memoria? È qui, solo un po' incasinato (è colpa del robot, onestamente. Avrebbe dovuto fare di meglio che fidarsi di noi per un'operazione così delicata).

[* black] Fair warning, there were some minor casualties in today's [guide|126000|board delamination|stepid=243561|new_window=true]. A little slip of the knife at 300° C is all it took to smear some of these chips right off the board. We blame our [https://www.ifixit.com/User/1/iRobot|robot intern]. Here are some of the bits he managed to salvage:
[* red] 128 GB of [https://business.kioxia.com/en-us/memory/mlc-nand.html|Kioxia NAND flash|new_window=true] memory
- [* orange] ST Microelectronics STB601A power management IC
+ [* orange] STMicroelectronics STB601A power management IC
[* yellow] Qualcomm's [https://www.techinsights.com/blog/analysis-qualcomms-snapdragon-sdr865-transceiver-supporting-5g-sub-6-ghz-and-lte-services|SDR865|new_window=true] 5G and LTE transceiver, [https://www.qualcomm.com/products/snapdragon-x55-5g-modem|SDX55M|new_window=true] 5G modem-RF system, and SMR526 intermediate frequency IC
[* green] USI 339S00761 WLAN / Bluetooth module
[* light_blue] Avago 8200 high/mid-band power amplifier with integrated duplexer
[* blue] Murata 1XR-482 mmWave front-end module
[* icon_note] Looking for that sweet, sweet A14 chip with 6 GB of layered memory? Keep reading for a detailed look at the rest of the board.

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