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Desmontaje del iPhone 12 Pro Max

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Paso 10
iPhone 12 Pro Max Teardown: paso 0, imagen 1 de 3 iPhone 12 Pro Max Teardown: paso 0, imagen 2 de 3 iPhone 12 Pro Max Teardown: paso 0, imagen 3 de 3

  • Fair warning, there were some minor casualties in today's board delamination. A little slip of the knife at 300° C is all it took to smear some of these chips right off the board. We blame our robot intern. Here are some of the bits he managed to salvage:

  • 128 GB of Kioxia NAND flash memory

  • STMicroelectronics STB601A power management IC

  • Qualcomm's SDR865 5G and LTE transceiver, SDX55M 5G modem-RF system, and SMR526 intermediate frequency IC

  • USI 339S00761 WLAN / Bluetooth module

  • Avago 8200 high/mid-band power amplifier with integrated duplexer

  • Murata 1XR-482 mmWave front-end module

  • Looking for that sweet, sweet A14 chip with 6 GB of layered memory? Keep reading for a detailed look at the rest of the board.

Atención, ha habido algunos accidentes menores durante el reemplazo de los turnos individuales de hoy. Un pequeño deslizamiento con un cuchillo a 300°C fue suficiente para barrer los chips completamente del tablero. Culpamos a nuestro aprendiz de robot. Aquí están las partes que pudo salvar:

128 GB de memoria flash NAND Kioxia

CI de administración de energía ST Microelectronics STB601A

El transceptor SDR865 5G y LTE Qualcomm, el sistema de modem-RF SDX55M 5G y el CI de frecuencia intermedia SMR526

Módulo Bluetooth / WLAN USI 339S00761

Amplificador de potencia de banda media/alta de Avago 8200 con duplexor integrado

Módulo frontal de ondas Murata 1XR-482 mmWave

¿Buscando ese dulce, dulce chip A14 con más de 6 GB de memoria? Está aquí, un poco desordenado. (Es culpa del robot, honestamente... debería haber sabido mejor que confiar en nosotros para una operación tan delicada.)

-[* black] Fair warning, there were some minor casualties in today's [guide|126000|board delamination|stepid=243561|new_window=true]. A little slip of the knife at 300° C is all it took to smear some of these chips right off the board. We blame our [https://www.ifixit.com/User/1/iRobot|robot intern]. Here are the bits he managed to salvage:
+[* black] Fair warning, there were some minor casualties in today's [guide|126000|board delamination|stepid=243561|new_window=true]. A little slip of the knife at 300° C is all it took to smear some of these chips right off the board. We blame our [https://www.ifixit.com/User/1/iRobot|robot intern]. Here are some of the bits he managed to salvage:
[* red] 128 GB of [https://business.kioxia.com/en-us/memory/mlc-nand.html|Kioxia NAND flash|new_window=true] memory
- [* orange] ST Microelectronics STB601A power management IC
+ [* orange] STMicroelectronics STB601A power management IC
[* yellow] Qualcomm's [https://www.techinsights.com/blog/analysis-qualcomms-snapdragon-sdr865-transceiver-supporting-5g-sub-6-ghz-and-lte-services|SDR865|new_window=true] 5G and LTE transceiver, [https://www.qualcomm.com/products/snapdragon-x55-5g-modem|SDX55M|new_window=true] 5G modem-RF system, and SMR526 intermediate frequency IC
[* green] USI 339S00761 WLAN / Bluetooth module
[* light_blue] Avago 8200 high/mid-band power amplifier with integrated duplexer
[* blue] Murata 1XR-482 mmWave front-end module
-[* icon_note] Looking for that sweet, sweet A14 chip layered over 6 GB of memory? It's [https://d3nevzfk7ii3be.cloudfront.net/igi/1YHq5IgxtlBb2lxo.full|here|new_window=true], just a little messy. (It's the robot's fault, honestly—he should have known better than to trust us with such a delicate operation.)
+[* icon_note] Looking for that sweet, sweet A14 chip with 6 GB of layered memory? Keep reading for a detailed look at the rest of the board.

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