Repara tus cosas Comunidad Tienda

Desmontaje del Samsung Galaxy Z Flip

Volver a la Guía
Inglés
Español
Paso 7
Samsung Galaxy Z Flip Teardown: paso 0, imagen 1 de 2 Samsung Galaxy Z Flip Teardown: paso 0, imagen 2 de 2

  • The Flip packs a dense, double-stacked motherboard—known in the industry as a substrate-like PCB. We first saw this space-saving technology in the iPhone X, and more recently in the Note10. It makes life harder for board repair experts, but also packs a lot of chips into a tiny space:

  • Samsung K3UH7H70AM-AGCL 8 GB LPDDR4X RAM layered on top of the Snapdragon 855 CPU

  • Samsung KLUEG8UHDB-C2D1 UFS 3.1 256 GB NAND Flash

  • Broadcom AFEM-9106 front-end module

  • Skyworks SKY78160-51 Low Noise Amplifier

  • Qualcomm SDR8150 RF transceiver

  • Qualcomm WCN3998 WiFi + Bluetooth SoC

  • NXP Semiconductor PN80T NFC controller w/ Secure Element

El Flip contiene una placa madre densa y doblemente apilada, conocida en la industria como un PCB similar a un sustrato. Vimos por primera vez esta tecnología de ahorro de espacio en el iPhone X, y más recientemente en el Note10. Hace la vida más difícil a los expertos en reparación de placas, pero también empaqueta muchos chips en un espacio diminuto:

Samsung 925 K3UH7H7 (probablemente 8 GB de RAM sobre la CPU Snapdragon 855)

Samsung 949 KLUEG8UHDB (probablemente los 256 GB de almacenamiento flash)

Módulo frontal del Broadcom AFEM-9106

Amplificador de bajo ruido Skyworks 78160-51

Transceptor de RF SDR8150 de Qualcomm

Qualcomm WCN3998 WiFi + Bluetooth SoC

NXP 80T17 Controlador NFC

[* black] The Flip packs a dense, double-stacked motherboard—known in the industry as a [https://www.quick-pcba.com/pcb-news/substrate-like-pcb-technology.html|substrate-like PCB|new_window=true]. We first saw this space-saving technology in the [guide|98975|iPhone X|stepid=182892|new_window=true], and more recently in the [guide|125590|Note10|stepid=242798|new_window=true]. It makes life harder for board repair experts, but also packs a lot of chips into a tiny space:
- [* red] Samsung 925 K3UH7H7 (likely 8 GB of RAM layered on top of the Snapdragon 855 CPU)
- [* orange] Samsung 949 KLUEG8UHDB (likely the 256 GB of flash storage)
+ [* red] Samsung [link|https://www.samsung.com/semiconductor/dram/lpddr4x/K3UH7H70AM-AGCL/|K3UH7H70AM-AGCL|new_window=true] 8 GB LPDDR4X RAM layered on top of the Snapdragon 855 CPU
+ [* orange] Samsung KLUEG8UHDB-C2D1 UFS 3.1 256 GB NAND Flash
[* yellow] Broadcom AFEM-9106 front-end module
- [* green] Skyworks 78160-51 low noise amplifier
+ [* green] Skyworks [link|https://store.skyworksinc.com/products/detail/sky7816051-skyworks/625141/|SKY78160-51|new_window=true] Low Noise Amplifier
[* light_blue] Qualcomm SDR8150 RF transceiver
- [* blue] Qualcomm WCN3998 WiFi + Bluetooth SoC
- [* violet] NXP 80T17 NFC controller
+ [* blue] Qualcomm [link|https://www.qualcomm.com/news/releases/2018/02/21/qualcomm-introduces-industrys-first-integrated-80211ax-ready-solution|WCN3998|new_window=true] WiFi + Bluetooth SoC
+ [* violet] NXP Semiconductor [link|https://media.nxp.com/news-releases/news-release-details/nxp-and-garmin-team-bring-secure-and-convenient-nfc-mobile|PN80T|new_window=true] NFC controller w/ Secure Element

Tus contribuciones son autorizadas bajo la licencia de código abierto de Creative Commons.