Traduciendo paso 9
Paso 9
-
All this glue has us tired—let's sit down for some chips:
-
Micron MT53D1024M32D4DT-046 AIT:D 4 GB LPDDR4X DRAM layered over Qualcomm Snapdragon 845
-
Skhynix H28S7Q302BMR 64 GB NAND flash (universal flash storage)
-
Google SR3HX Pixel Visual Core (as seen in the Pixel 2 XL)
-
Qualcomm SDR845 RF Transceiver
-
Qualcomm QPM2622 and QPM2642 low and high band power amplifier module (PAMiD)
-
Qualcomm QET4100 40MHz envelope tracker
-
Qualcomm PMI8998 PMIC
[* black] All this glue has us tired—let's sit down for some chips: | |
- | [* red] Micron |
- | [* orange] Skhynix [https://www.skhynix.com/eng/product/nandUFS.jsp|H28S7Q302BMR|new_window=true] 64 GB |
+ | [* red] Micron MT53D1024M32D4DT-046 AIT:D 4 GB LPDDR4X DRAM layered over Qualcomm Snapdragon 845 |
+ | [* orange] Skhynix [https://www.skhynix.com/eng/product/nandUFS.jsp|H28S7Q302BMR|new_window=true] 64 GB NAND flash (universal flash storage) |
[* yellow] Google [https://blog.google/products/pixel/pixel-visual-core-image-processing-and-machine-learning-pixel-2/|SR3HX|new_window=true] Pixel Visual Core (as seen in the [guide|98093|Pixel 2 XL|stepid=180076|new_window=true]) | |
[* green] Qualcomm SDR845 RF Transceiver | |
- | [* light_blue] Qualcomm QPM2622 and QPM2642 |
+ | [* light_blue] Qualcomm QPM2622 and QPM2642 low and high band power amplifier module (PAMiD) |
[* blue] Qualcomm [https://www.qualcomm.com/news/releases/2016/02/17/qualcomm-technologies-announces-next-generation-qualcomm-rf360-front-end|QET4100|new_window=true] 40MHz envelope tracker | |
[* violet] Qualcomm [http://www.eenewspower.com/news/adaptive-power-management-added-mobile-chipset|PMI8998|new_window=true] PMIC |
Tus contribuciones son autorizadas bajo la licencia de código abierto de Creative Commons.