Traduciendo paso 9
Paso 9

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All this glue has us tired—let's sit down for some chips:
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Micron 8JE77G9WGH 4 GB LPDDR4X DRAM layered over Qualcomm Snapdragon 845
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Skhynix H28S7Q302BMR 64 GB universal flash storage
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Google SR3HX Pixel Visual Core (as seen in the Pixel 2 XL)
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Qualcomm SDR845 RF Transceiver
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Qualcomm QPM2622 and QPM2642 low and high band power amplifier module (PAMiD)
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Qualcomm QET4100 40MHz envelope tracker
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Qualcomm PMI8998 PMIC
[* black] All this glue has us tired—let's sit down for some chips: |
[* red] Micron 8JE77G9WGH 4 GB LPDDR4X DRAM layered over Qualcomm Snapdragon 845 |
[* orange] Skhynix [https://www.skhynix.com/eng/product/nandUFS.jsp|H28S7Q302BMR|new_window=true] 64 GB |
[* orange] Skhynix [https://www.skhynix.com/eng/product/nandUFS.jsp|H28S7Q302BMR|new_window=true] 64 GB |
[* yellow] Google [https://blog.google/products/pixel/pixel-visual-core-image-processing-and-machine-learning-pixel-2/|SR3HX|new_window=true] Pixel Visual Core (as seen in the [guide|98093|Pixel 2 XL|stepid=180076|new_window=true]) |
[* green] Qualcomm SDR845 RF Transceiver |
[* light_blue] Qualcomm QPM2622 and QPM2642 low and high band power amplifier module (PAMiD) |
[* light_blue] Qualcomm QPM2622 and QPM2642 low and high band power amplifier module (PAMiD) |
[* blue] Qualcomm [https://www.qualcomm.com/news/releases/2016/02/17/qualcomm-technologies-announces-next-generation-qualcomm-rf360-front-end|QET4100|new_window=true] 40MHz envelope tracker |
[* violet] Qualcomm [http://www.eenewspower.com/news/adaptive-power-management-added-mobile-chipset|PMI8998|new_window=true] PMIC |
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