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Aviso: Estás editando un prerrequisito para la guía que estabas viendo hace poco. Cualquier cambio que realices afectará todas las 12 guías que incluyan este paso.

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Paso 2
Remove the shield plate from the device. A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. Use our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro. A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. Use our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro.
  • Remove the shield plate from the device.

  • A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. Use our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro.

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