Removal of CSP (chip scale package) devices from PCB and solder ball rework
Mi Problema
The product is used in a failure analysis lab, so the device/chip was removed to determine root cause failure. Due to the small size of the CSP devices, some level of magnification is helpful for delicate handling with tweezers.
Mi SoluciĆ³n
We primarily have one guy in the lab to do all the "dirty" work, and he has high success rate in removing the CSP devices. The repair is rebuilding/reflowing the CSP solder balls to allow testing of the devices.
Mi Consejo
- LOTS of patience.
- A good stereo microscope on an adjustable microscope
stand for X, Y, Z movement.
- Hot air or infrared solder wand with backheater soldering
equipment.
- Carbon tweezers for non-heated general handling.
- Coated tip tweezers for heated and hazardous chemical
applications.
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