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Versión actual por: mark munro ,

Texto:

Macmini 2011:
 
* 8GB ram
* 60GB SSD
* 1 TB WD HD
 
''':::::::::::::::::::::::::::::: idle load :::::::::::::::::::::::::::::::::::::::::::::::::::'''
 
'''''Treatment I:'''''
 
'''condition 1: flat placement on class surface. (horizontal)'''
 
* idle temp (out of the box) 69.3 degrees C (on average over 10,000 samples taken over 2 days)
* Ambient air temperature 22.6 degrees on average over testing period.
* Case temperature: 43.4 degrees measured with ON-409 and ON-909 Series Surface Thermistor Temperature Sensors placed at positions 3 cm from each corner on the top of the mini. 5th sensor placed just below the apple. Hotspots verified using thermograph. 1,000,000 readings taken over 2 days.
 
'''condition 2: Mini placed (vertical) in a NewerTech NuStand Alloy'''
 
[http://www.geeky-gadgets.com/wp-content/uploads/2010/12/NewerTech-NuStand-Alloy-Mac-Mini.jpg]
 
repeated tests in treatment 1
 
results:
 
* ambient air temperatre 21.9 degrees C
* idle temp 64.1 degrees
* surface temperature 38.9
* ambient air temp found to be insignificant (statistically)
* Data fed into matlab and processed in all cases
 
'''Conclusion:''' mini orientation has a significant impact on operating temperature possibly due to the flat surface area and the pattern of air movement created when operating. Eddies form on the surface producing a boundary layer impeding removal of heat. In the upright postion, formation of eddies are minimized allowing for convective currents to dissipate heat more effectively.
 
'''''Treatment II'''''
 
* removing and replacing thermal interface with Arctic Silver 5 via the line method.
* 200 hour break in period with 4 cool down cycles each 12 hours in duration.
* repeat procedures in Treatment 1.
 
'''condition 1:''' (horizontal)
 
* Ambient temperature 23.1 degrees
* Idle temperature 47.2 degrees average
* surface temperature 37.4 degrees average
 
'''condition 2''': (vertical)
 
* Ambient temperature 22.6 degrees
* Idle temperature 45.9 degrees
* Surface temperature 38.1 degrees
 
'''Conclusion''': The internal cooling system's efficiency was able to keep the mini's temperature stable in both the vertical and flat orientations. Although we saw 1.3 degrees difference between the positions, the orientation was not significant at idle processor loads, thus it made no difference. Temperatures did not reach high enough levels to allow convective passive cooling to have an effect.
 
'''::::::::::::::::::::::::::::::::: under load ::::::::::::::::::::::::::::::::::::::::'''
 
'''Treatment I (Stock thermal interface) 4 instances of yes > /dev/null'''
 
'''condition 1''': (horizontal)
 
* ambient temperature 23.2 degrees
* processor temperature 98.1 degrees
* case temp 67.9 degrees
 
'''Condition 2''': (vertical)
 
* ambient temperature 22.7 degrees
* processor temperature 92.1 degrees
* case temp 61.9 degrees
 
'''Treatment II (AC5 replacement interface) 4 instances of yes > /dev/null'''
 
'''Condition 1''': (horizontal)
 
* ambient temperature 23.7 degrees
* processor temperature 88.1 degrees
* case temp 55.8 degrees
* fan speed 5430 (average)
 
'''Condition 1:''' (Vertical)
 
* ambient temperature 22.5 degrees
* processor temperature 86.1 degrees
* case temp 35.2 degrees
* fan speed 4450 rpm (average)
 
'''Conclusion:''' Mini orientation had a small effect on processor temperature between the two position as the efficiency of the active cooling system was able to keep the mini within 2 degrees between the two conditions after AC5 was applied, indicating that active cooling had a significantly greater impact (statically) over passive cooling. The remarkable drop in case temperature seen in both idle load and max load demonstrate that orientation of the mini reduces the work load on the active cooling system as seen in fan speeds resulting in quieter operation. A combination of orientation and thermal interface placement appears to have the greatest effect. Temperature spikes where all seen initially before temperatures normalized.
 
Running plex with sample reference 1080p mkv video saw fan speeds average out at 2297rpm and cpu temperature average 81 degrees C. More testing is required to verify these numbers, but since I'm perfectly happy with the results, I'm not going to go through any more trouble with this.
 
Before you comment that I have way too much time on my hands, note that I'm finishing up my masters in engineering and this was simply an exercise in curiosity. The experimental design could be more controlled, but its only a macmini.
 
'''Errata'''
 
'''Errata'''
I
I don't see any issue with the cooling system once the thermal interface has been replaced. Drilling holes in the case does little to improve airflow IMHO and only compromises the integrity of the case. Properly applying AC5 should be sufficient. Measuring the airflow volume with and without the bottom attached yielded minimal flow rate increases which where measured and barely detectable with a research quality flow meter. Perhaps (if one was inclined), adding a thermoelectric peltier cooler would be a more viable option if you're intention was to drop the temp to sub 40degree C levels.
'''Errata'''
I
I don't see any issue with the cooling system once the thermal interface has been replaced. Drilling holes in the case does little to improve airflow IMHO and only compromises the integrity of the case. Properly applying AC5 should be sufficient. Measuring the airflow volume with and without the bottom attached yielded minimal flow rate increases which where measured and barely detectable with a research quality flow meter. Perhaps (if one was inclined), adding a thermoelectric peltier cooler would be a more viable option if you're intention was to drop the temp to sub 40degree C levels.

Estatus:

open

Editado por: mark munro ,

Texto:

Macmini 2011:
 
* 8GB ram
* 60GB SSD
* 1 TB WD HD
 
''':::::::::::::::::::::::::::::: idle load :::::::::::::::::::::::::::::::::::::::::::::::::::'''
 
'''''Treatment I:'''''
 
'''condition 1: flat placement on class surface. (horizontal)'''
 
* idle temp (out of the box) 69.3 degrees C (on average over 10,000 samples taken over 2 days)
* Ambient air temperature 22.6 degrees on average over testing period.
* Case temperature: 43.4 degrees measured with ON-409 and ON-909 Series Surface Thermistor Temperature Sensors placed at positions 3 cm from each corner on the top of the mini. 5th sensor placed just below the apple. Hotspots verified using thermograph. 1,000,000 readings taken over 2 days.
 
'''condition 2: Mini placed (vertical) in a NewerTech NuStand Alloy'''
[http://www.geeky-gadgets.com/wp-content/uploads/2010/12/NewerTech-NuStand-Alloy-Mac-Mini.jpg]
 
 
[http://www.geeky-gadgets.com/wp-content/uploads/2010/12/NewerTech-NuStand-Alloy-Mac-Mini.jpg]
 
repeated tests in treatment 1
 
results:
 
* ambient air temperatre 21.9 degrees C
* idle temp 64.1 degrees
* surface temperature 38.9
* ambient air temp found to be insignificant (statistically)
* Data fed into matlab and processed in all cases
 
'''Conclusion:''' mini orientation has a significant impact on operating temperature possibly due to the flat surface area and the pattern of air movement created when operating. Eddies form on the surface producing a boundary layer impeding removal of heat. In the upright postion, formation of eddies are minimized allowing for convective currents to dissipate heat more effectively.
 
'''''Treatment II'''''
 
* removing and replacing thermal interface with Arctic Silver 5 via the line method.
* 200 hour break in period with 4 cool down cycles each 12 hours in duration.
* repeat procedures in Treatment 1.
 
'''condition 1:''' (horizontal)
 
* Ambient temperature 23.1 degrees
* Idle temperature 47.2 degrees average
* surface temperature 37.4 degrees average
 
'''condition 2''': (vertical)
 
* Ambient temperature 22.6 degrees
* Idle temperature 45.9 degrees
* Surface temperature 38.1 degrees
 
'''Conclusion''': The internal cooling system's efficiency was able to keep the mini's temperature stable in both the vertical and flat orientations. Although we saw 1.3 degrees difference between the positions, the orientation was not significant at idle processor loads, thus it made no difference. Temperatures did not reach high enough levels to allow convective passive cooling to have an effect.
 
'''::::::::::::::::::::::::::::::::: under load ::::::::::::::::::::::::::::::::::::::::'''
 
'''Treatment I (Stock thermal interface) 4 instances of yes > /dev/null'''
 
'''condition 1''': (horizontal)
 
* ambient temperature 23.2 degrees
* processor temperature 98.1 degrees
* case temp 67.9 degrees
 
'''Condition 2''': (vertical)
 
* ambient temperature 22.7 degrees
* processor temperature 92.1 degrees
* case temp 61.9 degrees
 
'''Treatment II (AC5 replacement interface) 4 instances of yes > /dev/null'''
 
'''Condition 1''': (horizontal)
 
* ambient temperature 23.7 degrees
* processor temperature 88.1 degrees
* case temp 55.8 degrees
* fan speed 5430 (average)
 
'''Condition 1:''' (Vertical)
 
* ambient temperature 22.5 degrees
* processor temperature 86.1 degrees
* case temp 35.2 degrees
* fan speed 4450 rpm (average)
 
'''Conclusion:''' Mini orientation had a small effect on processor temperature between the two position as the efficiency of the active cooling system was able to keep the mini within 2 degrees between the two conditions after AC5 was applied, indicating that active cooling had a significantly greater impact (statically) over passive cooling. The remarkable drop in case temperature seen in both idle load and max load demonstrate that orientation of the mini reduces the work load on the active cooling system as seen in fan speeds resulting in quieter operation. A combination of orientation and thermal interface placement appears to have the greatest effect. Temperature spikes where all seen initially before temperatures normalized.
 
Running plex with sample reference 1080p mkv video saw fan speeds average out at 2297rpm and cpu temperature average 81 degrees C. More testing is required to verify these numbers, but since I'm perfectly happy with the results, I'm not going to go through any more trouble with this.
 
Before you comment that I have way too much time on my hands, note that I'm finishing up my masters in engineering and this was simply an exercise in curiosity. The experimental design could be more controlled, but its only a macmini.
 
 
'''Errata'''
I don't see any issue with the cooling system once the thermal interface has been replaced. Drilling holes in the case does little to improve airflow IMHO and only compromises the integrity of the case. Properly applying AC5 should be sufficient. Measuring the airflow volume with and without the bottom attached yielded minimal increases which where measured and barely detectable with a research quality flow meter. Perhaps (if one was inclined), adding a thermoelectric peltier cooler would be a more viable option if you're intention was to drop the temp to sub 40degree C levels.

Estatus:

open

Editado por: mark munro ,

Texto:

Macmini 2011:
 
* 8GB ram
* 60GB SSD
* 1 TB WD HD
 
 
''':::::::::::::::::::::::::::::: idle load :::::::::::::::::::::::::::::::::::::::::::::::::::'''
 
'''''Treatment I:'''''
 
'''condition 1: flat placement on class surface. (horizontal)'''
 
* idle temp (out of the box) 69.3 degrees C (on average over 10,000 samples taken over 2 days)
* Ambient air temperature 22.6 degrees on average over testing period.
* Case temperature: 43.4 degrees measured with ON-409 and ON-909 Series Surface Thermistor Temperature Sensors placed at positions 3 cm from each corner on the top of the mini. 5th sensor placed just below the apple. Hotspots verified using thermograph. 1,000,000 readings taken over 2 days.
 
'''condition 2: Mini placed (vertical) in a newertech aluminum stand'''NewerTech NuStand Alloy'''
[http://www.geeky-gadgets.com/wp-content/uploads/2010/12/NewerTech-NuStand-Alloy-Mac-Mini.jpg]

'''condition 2: Mini placed (vertical) in a newertech aluminum stand'''NewerTech NuStand Alloy'''
[http://www.geeky-gadgets.com/wp-content/uploads/2010/12/NewerTech-NuStand-Alloy-Mac-Mini.jpg]

 
repeated tests in treatment 1
 
results:
 
* ambient air temperatre 21.9 degrees C
* idle temp 64.1 degrees
* surface temperature 38.9
* ambient air temp found to be insignificant (statistically)
* Data fed into matlab and processed in all cases
 
'''Conclusion:''' mini orientation has a significant impact on operating temperature possibly due to the flat surface area and the pattern of air movement created when operating. Eddies form on the surface producing a boundary layer impeding removal of heat. In the upright postion, formation of eddies are minimized allowing for convective currents to dissipate heat more effectively.
 
'''''Treatment II'''''
 
* removing and replacing thermal interface with Arctic Silver 5 via the line method.
* 200 hour break in period with 4 cool down cycles each 12 hours in duration.
* repeat procedures in Treatment 1.
 
'''condition 1:''' (horizontal)
 
* Ambient temperature 23.1 degrees
* Idle temperature 47.2 degrees average
* surface temperature 37.4 degrees average
 
'''condition 2''': (vertical)
 
* Ambient temperature 22.6 degrees
* Idle temperature 45.9 degrees
* Surface temperature 38.1 degrees
 
'''Conclusion''': The internal cooling system's efficiency was able to keep the mini's temperature stable in both the vertical and flat orientations. Although we saw 1.3 degrees difference between the positions, the orientation was not significant at idle processor loads, thus it made no difference. Temperatures did not reach high enough levels to allow convective passive cooling to have an effect.
 
'''::::::::::::::::::::::::::::::::: under load ::::::::::::::::::::::::::::::::::::::::'''
 
'''Treatment I (Stock thermal interface) 4 instances of yes > /dev/null'''
 
'''condition 1''': (horizontal)
 
* ambient temperature 23.2 degrees
* processor temperature 98.1 degrees
* case temp 67.9 degrees
 
'''Condition 2''': (vertical)
 
* ambient temperature 22.7 degrees
* processor temperature 92.1 degrees
* case temp 61.9 degrees
 
'''Treatment II (AC5 replacement interface) 4 instances of yes > /dev/null'''
 
'''Condition 1''': (horizontal)
 
* ambient temperature 23.7 degrees
* processor temperature 88.1 degrees
* case temp 55.8 degrees
* fan speed 5430 (average)
 
'''Condition 1:''' (Vertical)
 
* ambient temperature 22.5 degrees
* processor temperature 86.1 degrees
* case temp 35.2 degrees
* fan speed 4450 rpm (average)
 
'''Conclusion:''' Mini orientation had a small effect on processor temperature between the two position as the efficiency of the active cooling system was able to keep the mini within 2 degrees between the two conditions after AC5 was applied, indicating that active cooling had a significantly greater impact (statically) over passive cooling. The remarkable drop in case temperature seen in both idle load and max load demonstrate that orientation of the mini reduces the work load on the active cooling system as seen in fan speeds resulting in quieter operation. A combination of orientation and thermal interface placement appears to have the greatest effect. Temperature spikes where all seen initially before temperatures normalized.
 
Running plex with sample reference 1080p mkv video saw fan speeds average out at 2297rpm and cpu temperature average 81 degrees C. More testing is required to verify these numbers, but since I'm perfectly happy with the results, I'm not going to go through any more trouble with this.
 
Before you comment that I have way too much time on my hands, note that I'm finishing up my masters in engineering and this was simply an exercise in curiosity. The experimental design could be more controlled, but its only a macmini.

Estatus:

open

Editado por: mark munro ,

Texto:

Macmini 2011:
* 8GB ram
* 60GB SSD
* 1 TB WD HD
 
:::::::::::::::::::::::::::::: idle load :::::::::::::::::::::::::::::::::::::::::::::::::::
 
::::Treatment I:''':::::::::::::::::::::::::::::: idle load :::::::::::::::::::::::::::::::::::::::::::::::::::'''
::::Treatment I:''':::::::::::::::::::::::::::::: idle load :::::::::::::::::::::::::::::::::::::::::::::::::::'''
 
condition 1: flat placement on class surface. (horizontal)'''''Treatment I:'''''
condition 1: flat placement on class surface. (horizontal)'''''Treatment I:'''''
 
-idle temp (out of the box) 69.3 degrees C (on average over 10,000 samples taken over 2 days)'''condition 1: flat placement on class surface. (horizontal)'''
-idle temp (out of the box) 69.3 degrees C (on average over 10,000 samples taken over 2 days)'''condition 1: flat placement on class surface. (horizontal)'''
 
-Ambient* idle temp (out of the box) 69.3 degrees C (on average over 10,000 samples taken over 2 days)
* Ambient
air temperature 22.6 degrees on average over testing period.
* Case temperature: 43.4 degrees measured with ON-409 and ON-909 Series Surface Thermistor Temperature Sensors placed at positions 3 cm from each corner on the top of the mini. 5th sensor placed just below the apple. Hotspots verified using thermograph. 1,000,000 readings taken over 2 days.
-Ambient* idle temp (out of the box) 69.3 degrees C (on average over 10,000 samples taken over 2 days)
* Ambient
air temperature 22.6 degrees on average over testing period.
* Case temperature: 43.4 degrees measured with ON-409 and ON-909 Series Surface Thermistor Temperature Sensors placed at positions 3 cm from each corner on the top of the mini. 5th sensor placed just below the apple. Hotspots verified using thermograph. 1,000,000 readings taken over 2 days.
 
-Case temperature: 43.4 degrees measured with ON-409 and ON-909 Series Surface Thermistor Temperature Sensors'''condition 2: Mini placed at positions 3 cm from each corner on the top of the mini. 5th sensor placed just below the apple. Hotspots verified using thermograph. 1,000,000 readings taken over 2 days.(vertical) in a newertech aluminum stand'''
-Case temperature: 43.4 degrees measured with ON-409 and ON-909 Series Surface Thermistor Temperature Sensors'''condition 2: Mini placed at positions 3 cm from each corner on the top of the mini. 5th sensor placed just below the apple. Hotspots verified using thermograph. 1,000,000 readings taken over 2 days.(vertical) in a newertech aluminum stand'''
 
condition 2: Mini placed (vertical) in a newertech aluminum stand

-repeated
repeated tests in treatment 1
condition 2: Mini placed (vertical) in a newertech aluminum stand

-repeated
repeated tests in treatment 1
 
results:
* ambient air temperatre 21.9 degrees C
* idle temp 64.1 degrees
* surface temperature 38.9
* ambient air temp found to be insignificant (statistically)
* Data fed into matlab and processed in all cases
 
-ambient air temperatre 21.9 degrees C

-idle temp 64.1 degrees

-surface temperature 38.9

-ambient air temp found to be insignificant (statistically)

-Data fed into matlab and processed in all cases

Conclusion:
'''Conclusion:''' mini orientation has a significant impact on operating temperature possibly due to the flat surface area and the pattern of air movement created when operating. Eddies form on the surface producing a boundary layer impeding removal of heat. In the upright postion, formation of eddies are minimized allowing for convective currents to dissipate heat more effectively.

::::Treatment II

-removing and replacing thermal interface with Arctic Silver 5 via the line method.

-200 hour break in period with 4 cool down cycles each 12 hours in duration.

repeat procedures in Treatment 1.

condition 1: (horizontal)

-Ambient temperature 23.1 degrees

-Idle temperature 47.2 degrees average

-surface temperature 37.4 degrees average

condition 2: (vertical)

-Ambient temperature 22.6 degrees

- Idle temperature 45.9 degrees

- Surface temperature 38.1 degrees

Conclusion: The internal cooling system's efficiency was able to keep the mini's temperature stable in both the vertical and flat orientations. Although we saw 1.3 degrees difference between the positions, the orientation was not significant at idle processor loads, thus it made no difference. Temperatures did not reach high enough levels to allow convective passive cooling to have an effect.

::::::::::::::::::::::::::::::::: under load ::::::::::::::::::::::::::::::::::::::::

::::Treatment I (Stock thermal interface) 4 instances of yes > /dev/null

condition 1: (horizontal)
-ambient air temperatre 21.9 degrees C

-idle temp 64.1 degrees

-surface temperature 38.9

-ambient air temp found to be insignificant (statistically)

-Data fed into matlab and processed in all cases

Conclusion:
'''Conclusion:''' mini orientation has a significant impact on operating temperature possibly due to the flat surface area and the pattern of air movement created when operating. Eddies form on the surface producing a boundary layer impeding removal of heat. In the upright postion, formation of eddies are minimized allowing for convective currents to dissipate heat more effectively.

::::Treatment II

-removing and replacing thermal interface with Arctic Silver 5 via the line method.

-200 hour break in period with 4 cool down cycles each 12 hours in duration.

repeat procedures in Treatment 1.

condition 1: (horizontal)

-Ambient temperature 23.1 degrees

-Idle temperature 47.2 degrees average

-surface temperature 37.4 degrees average

condition 2: (vertical)

-Ambient temperature 22.6 degrees

- Idle temperature 45.9 degrees

- Surface temperature 38.1 degrees

Conclusion: The internal cooling system's efficiency was able to keep the mini's temperature stable in both the vertical and flat orientations. Although we saw 1.3 degrees difference between the positions, the orientation was not significant at idle processor loads, thus it made no difference. Temperatures did not reach high enough levels to allow convective passive cooling to have an effect.

::::::::::::::::::::::::::::::::: under load ::::::::::::::::::::::::::::::::::::::::

::::Treatment I (Stock thermal interface) 4 instances of yes > /dev/null

condition 1: (horizontal)
 
-ambient temperature 23.2 degrees'''''Treatment II'''''
-ambient temperature 23.2 degrees'''''Treatment II'''''
 
-processor temperature 98.1 degrees* removing and replacing thermal interface with Arctic Silver 5 via the line method.
* 200 hour break in period with 4 cool down cycles each 12 hours in duration.
* repeat procedures in Treatment 1.
-processor temperature 98.1 degrees* removing and replacing thermal interface with Arctic Silver 5 via the line method.
* 200 hour break in period with 4 cool down cycles each 12 hours in duration.
* repeat procedures in Treatment 1.
 
-case temp 67.9 degrees'''condition 1:''' (horizontal)
-case temp 67.9 degrees'''condition 1:''' (horizontal)
 
Condition 2: (vertical)* Ambient temperature 23.1 degrees
* Idle temperature 47.2 degrees average
* surface temperature 37.4 degrees average
Condition 2: (vertical)* Ambient temperature 23.1 degrees
* Idle temperature 47.2 degrees average
* surface temperature 37.4 degrees average
 
-ambient temperature 22.7 degrees'''condition 2''': (vertical)
-ambient temperature 22.7 degrees'''condition 2''': (vertical)
 
-processor* Ambient temperature 92.122.6 degrees
* Idle temperature 45.9 degrees
* Surface temperature 38.1
degrees
-processor* Ambient temperature 92.122.6 degrees
* Idle temperature 45.9 degrees
* Surface temperature 38.1
degrees
 
-case temp 61.9'''Conclusion''': The internal cooling system's efficiency was able to keep the mini's temperature stable in both the vertical and flat orientations. Although we saw 1.3 degrees difference between the positions, the orientation was not significant at idle processor loads, thus it made no difference. Temperatures did not reach high enough levels to allow convective passive cooling to have an effect.
-case temp 61.9'''Conclusion''': The internal cooling system's efficiency was able to keep the mini's temperature stable in both the vertical and flat orientations. Although we saw 1.3 degrees difference between the positions, the orientation was not significant at idle processor loads, thus it made no difference. Temperatures did not reach high enough levels to allow convective passive cooling to have an effect.
 
::::Treatment II (AC5 replacement interface)'''::::::::::::::::::::::::::::::::: under load ::::::::::::::::::::::::::::::::::::::::'''
::::Treatment II (AC5 replacement interface)'''::::::::::::::::::::::::::::::::: under load ::::::::::::::::::::::::::::::::::::::::'''
 
Condition 1: (horizontal)'''Treatment I (Stock thermal interface) 4 instances of yes > /dev/null'''
Condition 1: (horizontal)'''Treatment I (Stock thermal interface) 4 instances of yes > /dev/null'''
 
-ambient temperature 23.7 degrees'''condition 1''': (horizontal)
-ambient temperature 23.7 degrees'''condition 1''': (horizontal)
 
-processor* ambient temperature 88.123.2 degrees
* processor temperature 98.1 degrees
* case temp 67.9
degrees
-processor* ambient temperature 88.123.2 degrees
* processor temperature 98.1 degrees
* case temp 67.9
degrees
 
-case temp 55.8 degrees'''Condition 2''': (vertical)
-case temp 55.8 degrees'''Condition 2''': (vertical)
 
-fan speed 5430 (average)* ambient temperature 22.7 degrees
* processor temperature 92.1 degrees
* case temp 61.9 degrees
-fan speed 5430 (average)* ambient temperature 22.7 degrees
* processor temperature 92.1 degrees
* case temp 61.9 degrees
 
Condition 1: (Vertical)'''Treatment II (AC5 replacement interface) 4 instances of yes > /dev/null'''
Condition 1: (Vertical)'''Treatment II (AC5 replacement interface) 4 instances of yes > /dev/null'''
 
-ambient temperature 22.5 degrees'''Condition 1''': (horizontal)
-ambient temperature 22.5 degrees'''Condition 1''': (horizontal)
 
-processor* ambient temperature 86.123.7 degrees
* processor temperature 88.1 degrees
* case temp 55.8 degrees
* fan speed 5430 (average)
-processor* ambient temperature 86.123.7 degrees
* processor temperature 88.1 degrees
* case temp 55.8 degrees
* fan speed 5430 (average)
 
-case temp 35.2 degrees'''Condition 1:''' (Vertical)
-case temp 35.2 degrees'''Condition 1:''' (Vertical)
 
-* ambient temperature 22.5 degrees
* processor temperature 86.1 degrees
* case temp 35.2 degrees
*
fan speed 4450 rpm (average)
-* ambient temperature 22.5 degrees
* processor temperature 86.1 degrees
* case temp 35.2 degrees
*
fan speed 4450 rpm (average)
 
Conclusion:'''Conclusion:''' Mini orientation had a small effect on processor temperature between the two position as the efficiency of the active cooling system was able to keep the mini within 2 degrees between the two conditions after AC5 was applied, indicating that active cooling had a significantly greater impact (statically) over passive cooling. The remarkable drop in case temperature seen in both idle load and max load demonstrate that orientation of the mini reduces the work load on the active cooling system as seen in fan speeds resulting in quieter operation. A combination of orientation and thermal interface placement appears to have the greatest effect. Temperature spikes where all seen initially before temperatures normalized.
Conclusion:'''Conclusion:''' Mini orientation had a small effect on processor temperature between the two position as the efficiency of the active cooling system was able to keep the mini within 2 degrees between the two conditions after AC5 was applied, indicating that active cooling had a significantly greater impact (statically) over passive cooling. The remarkable drop in case temperature seen in both idle load and max load demonstrate that orientation of the mini reduces the work load on the active cooling system as seen in fan speeds resulting in quieter operation. A combination of orientation and thermal interface placement appears to have the greatest effect. Temperature spikes where all seen initially before temperatures normalized.
 
Running plex with sample reference 1080p mkv video saw fan speeds average out at 2297rpm and cpu temperature average 81 degrees C. More testing is required to verify these numbers, but since I'm perfectly happy with the results, I'm not going to go through any more trouble with this.
 
Before you comment that I have way too much time on my hands, note that I'm finishing up my masters in engineering and this was simply an exercise in curiosity. The experimental design could be more controlled, but its only a macmini.

Estatus:

open

Editado por: mark munro ,

Texto:

Macmini 2011:
 
:::::::::::::::::::::::::::::: idle load :::::::::::::::::::::::::::::::::::::::::::::::::::
 
::::Treatment I:
 
condition 1: flat placement on class surface. (horizontal)
 
-idle temp (out of the box) 69.3 degrees C (on average over 10,000 samples taken over 2 days)
 
-Ambient air temperature 22.6 degrees on average over testing period.
 
-Case temperature: 43.4 degrees measured with ON-409 and ON-909 Series Surface Thermistor Temperature Sensors placed at positions 3 cm from each corner on the top of the mini. 5th sensor placed just below the apple. Hotspots verified using thermograph. 1,000,000 readings taken over 2 days.
 
condition 2: Mini placed (vertical) in a newertech aluminum stand
 
-repeated tests in treatment 1
 
results:
 
-ambient air temperatre 21.9 degrees C
 
-idle temp 64.1 degrees
 
-surface temperature 38.9
 
-ambient air temp found to be insignificant (statistically)
 
-Data fed into matlab and processed in all cases
 
Conclusion: mini orientation has a significant impact on operating temperature possibly due to the flat surface area and the pattern of air movement created when operating. Eddies form on the surface producing a boundary layer impeding removal of heat. In the upright postion, formation of eddies are minimized allowing for convective currents to dissipate heat more effectively.
 
::::Treatment II
 
-removing and replacing thermal interface with Arctic Silver 5 via the line method.
 
-200 hour break in period with 4 cool down cycles each 12 hours in duration.
 
repeat procedures in Treatment 1.
 
condition 1: (horizontal)
 
-Ambient temperature 23.1 degrees
 
-Idle temperature 47.2 degrees average
 
-surface temperature 37.4 degrees average
 
condition 2: (vertical)
 
-Ambient temperature 22.6 degrees
 
- Idle temperature 45.9 degrees
 
- Surface temperature 38.1 degrees
 
Conclusion: The internal cooling system's efficiency was able to keep the mini's temperature stable in both the vertical and flat orientations. Although we saw 1.3 degrees difference between the positions, the orientation was not significant at idle processor loads, thus it made no difference. Temperatures did not reach high enough levels to allow convective passive cooling to have an effect.
 
::::::::::::::::::::::::::::::::: under load ::::::::::::::::::::::::::::::::::::::::
 
::::Treatment I (Stock thermal interface) 4 instances of yes > /dev/null
 
condition 1: (horizontal)
 
-ambient temperature 23.2 degrees
 
-processor temperature 98.1 degrees
 
-case temp 67.9 degrees
 
Condition 2: (vertical)
 
-ambient temperature 22.7 degrees
 
-processor temperature 92.1 degrees
 
-case temp 61.9 degrees
 
::::Treatment II (vertical placementAC5 replacement interface)
::::Treatment II (vertical placementAC5 replacement interface)
 
Condition 1: (horizontal)
 
-ambient temperature 23.7 degrees
 
-processor temperature 88.1 degrees
 
-case temp 55.8 degrees
 
-fan speed 5430 (average)
 
Condition 1: (Vertical)
 
-ambient temperature 22.5 degrees
 
-processor temperature 86.1 degrees
 
-case temp 35.2 degrees
 
- fan speed 4450 rpm (average)
 
Conclusion: Mini orientation had a small effect on processor temperature between the two position as the efficiency of the active cooling system was able to keep the mini within 2 degrees between the two conditions after AC5 was applied, indicating that active cooling had a significantly greater impact (statically) over passive cooling. The remarkable drop in case temperature seen in both idle load and max load demonstrate that orientation of the mini reduces the work load on the active cooling system as seen in fan speeds resulting in quieter operation. A combination of orientation and thermal interface placement appears to have the greatest effect. Temperature spikes where all seen initially before temperatures normalized.
Conclusion: Mini orientation had a small effect on processor temperature between the two position as the efficiency of the active cooling system was able to keep the mini within 2 degrees between the two conditions after AC5 was applied, indicating that active cooling had a significantly greater impact (statically) over passive cooling. The remarkable drop in case temperature seen in both idle load and max load demonstrate that orientation of the mini reduces the work load on the active cooling system as seen in fan speeds resulting in quieter operation. A combination of orientation and thermal interface placement appears to have the greatest effect. Temperature spikes where all seen initially before temperatures normalized.
 
Running plex with sample reference 1080p mkv video saw fan speeds average out at 2097rpm2297rpm and cpu speedstemperature average 7181 degrees C. More testing is required to verify these numbers, but since I'm perfectly happy with the results, I'm not going to go through any more trouble with this.
Running plex with sample reference 1080p mkv video saw fan speeds average out at 2097rpm2297rpm and cpu speedstemperature average 7181 degrees C. More testing is required to verify these numbers, but since I'm perfectly happy with the results, I'm not going to go through any more trouble with this.
 
Before you comment that I have way too much time on my hands, note that I'm finishing up my masters in engineering and this was simply an exercise in curiosity. The experimental design could be more controlled, but its only a macmini.

Estatus:

open

Aporte original por: mark munro ,

Texto:

Macmini 2011:

:::::::::::::::::::::::::::::: idle load :::::::::::::::::::::::::::::::::::::::::::::::::::

::::Treatment I:

condition 1: flat placement on class surface. (horizontal)

-idle temp (out of the box) 69.3 degrees C (on average over 10,000 samples taken over 2 days)

-Ambient air temperature 22.6 degrees on average over testing period.

-Case temperature: 43.4 degrees measured with ON-409 and ON-909 Series Surface Thermistor Temperature Sensors placed at positions 3 cm from each corner on the top of the mini.  5th sensor placed just below the apple.  Hotspots verified using thermograph. 1,000,000 readings taken over 2 days.

condition 2: Mini placed (vertical) in a newertech aluminum stand

-repeated tests in treatment 1

results:

-ambient air temperatre 21.9 degrees C

-idle temp 64.1 degrees

-surface temperature 38.9

-ambient air temp found to be insignificant (statistically)

-Data fed into matlab and processed in all cases

Conclusion: mini orientation has a significant impact on operating temperature possibly due to the flat surface area and the pattern of air movement created when operating.  Eddies form on the surface producing a boundary layer impeding removal of heat.  In the upright postion, formation of eddies are minimized allowing for convective currents to dissipate heat more effectively.

::::Treatment II

-removing and replacing thermal interface with Arctic Silver 5 via the line method.

-200 hour break in period with 4 cool down cycles each 12 hours in duration.

repeat procedures in Treatment 1.

condition 1: (horizontal)

-Ambient temperature 23.1 degrees

-Idle temperature 47.2 degrees average

-surface temperature 37.4 degrees average

condition 2: (vertical)

-Ambient temperature 22.6 degrees

- Idle temperature 45.9 degrees

- Surface temperature 38.1 degrees

Conclusion:  The internal cooling system's efficiency was able to keep the mini's temperature stable in both the vertical and flat orientations.  Although we saw 1.3 degrees difference between the positions, the orientation was not significant at idle processor loads, thus it made no difference.  Temperatures did not reach high enough levels to allow convective passive cooling to have an effect.

::::::::::::::::::::::::::::::::: under load ::::::::::::::::::::::::::::::::::::::::

::::Treatment I (Stock thermal interface) 4 instances of yes > /dev/null

condition 1: (horizontal)

-ambient temperature 23.2 degrees

-processor temperature 98.1 degrees

-case temp 67.9 degrees

Condition 2: (vertical)

-ambient temperature 22.7 degrees

-processor temperature 92.1 degrees

-case temp 61.9 degrees

::::Treatment II (vertical placement)

Condition 1: (horizontal)

-ambient temperature 23.7 degrees

-processor temperature 88.1 degrees

-case temp 55.8 degrees

-fan speed 5430 (average)

Condition 1: (Vertical)

-ambient temperature 22.5 degrees

-processor temperature 86.1 degrees

-case temp 35.2 degrees

- fan speed 4450 rpm (average)

Conclusion: Mini orientation had a small effect on processor temperature between the two position as the efficiency of the active cooling system was able to keep the mini within 2 degrees between the two conditions after AC5 was applied, indicating that active cooling had a significantly greater impact (statically) over passive cooling.  The remarkable drop in case temperature seen in both idle load and max load demonstrate that orientation of the mini reduces the work load on the active cooling system as seen in fan speeds resulting in quieter operation.  A combination of orientation and thermal interface placement appears to have the greatest effect.

Running plex with sample reference 1080p mkv video saw fan speeds average out at 2097rpm and cpu speeds average 71 degrees C.  More testing is required to verify these numbers, but since I'm perfectly happy with the results, I'm not going to go through any more trouble with this.

Before you comment that I have way too much time on my hands, note that I'm finishing up my masters in engineering and this was simply an exercise in curiosity.  The experimental design could be more controlled, but its only a macmini.

Estatus:

open