Saltar al contenido principal
Ayuda

Versión actual por: Tiem ,

Texto:

I pulled apart my mini tonight and re-applied Arctic Silver 5. I have only been up for about 2.5 hours and have yet to produce any thermal cycles, but the temperature is already down a good 6 C from before.
 
The process was utterly painless. For anyone that has taken apart a MBP1,1, you'll know what a joy this model is to work on.
 
For anyone with a modicum of skill, I would say dive in and remove the standard thermal compound. After AC5 has time to reach its full efficacy, I wouldn't be surprised to see an overall 10 C drop across the board. Even know, the 6 C is very much welcome.
 
As I write this, it is sitting at ''steady'' 46 C. Before AC5, it ran anywhere between 51-54C. I must admit I hesitated, but ultimately, I'm glad I did it.
 
'''Preliminary Data (follow up)Data'''
'''Preliminary Data (follow up)Data'''
 
I've had time to gather some preliminary data and run several heat cycles. It's now been about 120 hours since the application of AC5. I've also kept the ambient temperature outside the unit constant (increased at times actually, which made little difference in all honesty), at ~21 C.
 
Firstly, I applied the paste using the "rice drop" method. I placed a dab in the centre of each diode and squished it using the heatsink pads. I did not spread it (as is suggested by AC) as that leaves room for thinner points and often results in thermal paste leaking out the sides and acting as an insulator (the opposite of what we want).
 
The temperatures now generally remain at about 44 to 47 C during general use (surfing the web, playing songs in iTunes, mail open, and a few other general miscellanea running). This of course is with the mini outputting to a 23" monitor running at resolution of 2048x1152 pixels and running a secondary HDD (5,400 RPM 500 GB) on top of the primary SSD (so it's tight in there). When the monitor is put to sleep and the system allowed to idle (not sleep, but idle), the temperatures drop to around 41 (after several hours). Depending on the draw to the GPU, your mileage may vary.
 
During load, the temperature rise is much more progressive. The stock paste saw my mini spike in heat compared to the AC5, which sees a much smoother and gradual progression. The fan behaves the same in both cases.
 
One thing to note, when the chip is stressed, the CPU remains hot (about 50-51) for a considerable while, eventually coming back down to it's resting temp of ~45 C. I suspect this has to do with the extreme constraints of the components inside. Creating that much heat must bake the system and while the fan can cool the CPU, the other components will eventually heat up as well. Since a 51 C is actually the running temperature, the fans will not remain at a higher RPM to move the heat away, hence the system remains in that state longer). Again, this is temporary and after about 30 minutes of light use, it will subside.
 
At peak stress, the unit has not pushed past 70 C. The stock compound saw temperatures substantially higher (sometimes in almost 80 C). But I have no yet kept it under sustained load (will update when I reach AC5 thermal efficiency).
 
'''Final Stages of Reaching Thermal Efficacy'''
 
I have hit the 200 hour mark and have managed 4 full heat cycles (as outlined by AC5). The temperatures remain relatively stable from what was initially recorded. The system remains at ~47 C during light use. It rises to ~51 C with moderate use. I doubt there will be much of a reduction from this point on.
 
One thing to note. The application of AC5 doesn't necessarily "drop" the temperatures, rather than make the cooling more efficient. It's a bit misleading to claim that the CPU runs cooler because that rests entirely on the cooling system and that has not changed. AC5 certainly smoothens the temperature gradient and allows the CPU to rest at lower temperature, but outside of that, there won't be a miraculous change.
 
'''Additional Cooling Strategies'''
 
I should also mention that I've heard a lot about people raising their minis to allow more airflow. I put this to the test. I ran the unit raise 30 mm off the desk. No changes to temperature. So I went a step further and pulled the base off. That saw a 2 C reduction across the board. I went another step further and placed a small fan (blowing around 40 M3/H) aimed upwards. Surprisingly that saw no change in temperatures (above the 2 C from having the base removed). My theory would be that the components are so tightly packed and hidden away from the external fan, that blowing a bit of air on them was insufficient. It might be the case that a large fan would see a reduction to temperatures, but I'm more inclined to think that it would require a replacement of the existing fan with something more powerful (I want to look into this actually).

Estado:

open

Editado por: Tiem ,

Texto:

I pulled apart my mini tonight and re-applied Arctic Silver 5. I have only been up for about 2.5 hours and have yet to produce any thermal cycles, but the temperature is already down a good 6 C from before.
 
The process was utterly painless. For anyone that has taken apart a MBP1,1, you'll know what a joy this model is to work on.
 
For anyone with a modicum of skill, I would say dive in and remove the standard thermal compound. After AC5 has time to reach its full efficacy, I wouldn't be surprised to see an overall 10 C drop across the board. Even know, the 6 C is very much welcome.
 
As I write this, it is sitting at ''steady'' 46 C. Before AC5, it ran anywhere between 51-54C. I must admit I hesitated, but ultimately, I'm glad I did it.
 
'''Preliminary Data (follow up)'''
 
I've had time to gather some preliminary data and run several heat cycles. It's now been about 120 hours since the application of AC5. I've also kept the ambient temperature outside the unit constant (increased at times actually, which made little difference in all honesty), at ~21 C.
 
Firstly, I applied the paste using the "rice drop" method. I placed a dab in the centre of each diode and squished it using the heatsink pads. I did not spread it (as is suggested by AC) as that leaves room for thinner points and often results in thermal paste leaking out the sides and acting as an insulator (the opposite of what we want).
 
The temperatures now generally remain at about 44 to 47 C during general use (surfing the web, playing songs in iTunes, mail open, and a few other general miscellanea running). This of course is with the mini outputting to a 23" monitor running at resolution of 2048x1152 pixels and running a secondary HDD (5,400 RPM 500 GB) on top of the primary SSD (so it's tight in there). When the monitor is put to sleep and the system allowed to idle (not sleep, but idle), the temperatures drop to around 41 (after several hours). Depending on the draw to the GPU, your mileage may vary.
 
During load, the temperature rise is much more progressive. The sockstock paste saw my mini spike in heat compared to the AC5, which sees a much smoother and gradual progression. The fan behaves the same in both cases.
During load, the temperature rise is much more progressive. The sockstock paste saw my mini spike in heat compared to the AC5, which sees a much smoother and gradual progression. The fan behaves the same in both cases.
 
One thing to note, when the chip is stressed, the CPU remains hot (about 50-51) for a considerable while, eventually coming back down to it's resting temp of ~45 C. I suspect this has to do with the extreme constraints of the components inside. Creating that much heat must bake the system and while the fan can cool the CPU, the other components will eventually heat up as well. Since a 51 C is actually the running temperature, the fans will not remain at a higher RPM to move the heat away, hence the system remains in that state longer). Again, this is temporary and after about 30 minutes of light use, it will subside.
 
At peak stress, the unit has not pushed past 70 C. The stock compound saw temperatures substantially higher (sometimes in almost 80 C). But I have no yet kept it under sustained load (will update when I reach AC5 thermal efficiency).
 
'''Additional Cooling Strategies'''
 
I should also mention that I've heard a lot about people raising their minis to allow more airflow. I put this to the test. I ran the unit raise 30 mm off the desk. No changes to temperature. So I went a step further and pulled the base off. That saw a 2 C reduction across the board. I went another step further and placed a small fan (blowing around 40 M3/H) aimed upwards. Surprisingly that saw no change in temperatures (above the 2 C from having the base removed). My theory would be that the components are so tightly packed and hidden away from the external fan, that blowing a bit of air on them was insufficient. It might be the case that a large fan would see a reduction to temperatures, but I'm more inclined to think that it would require a replacement of the existing fan with something more powerful (I want to look into this actually).

Estado:

open

Editado por: Tiem ,

Texto:

I pulled apart my mini tonight and re-applied Arctic Silver 5. I have only been up for about 2.5 hours and have yet to produce any thermal cycles, but the temperature is already down a good 6 C from before.
 
The process was utterly painless. For anyone that has taken apart a MBP1,1, you'll know what a joy this model is to work on.
 
For anyone with a modicum of skill, I would say dive in and remove the standard thermal compound. After AC5 has time to reach its full efficacy, I wouldn't be surprised to see an overall 10 C drop across the board. Even know, the 6 C is very much welcome.
 
As I write this, it is sitting at ''steady'' 46 C. Before AC5, it ran anywhere between 51-54C. I must admit I hesitated, but ultimately, I'm glad I did it.
 
'''Preliminary Data (follow up)'''
 
I've had time to gather some preliminary data and run several heat cycles. It's now been about 120 hours since the application of AC5. I've also kept the ambient temperature outside the unit constant (increased at times actually, which made little difference in all honesty), at ~21 C.
 
Firstly, I applied the paste using the "rice drop" method. I placed a dab in the centre of each diode and squished it using the heatsink pads. I did not spread it (as is suggested by AC) as that leaves room for thinner points and often results in thermal paste leaking out the sides and acting as an insulator (the opposite of what we want).
 
The temperatures now generally remain at about 44 to 47 C during general use (surfing the web, playing songs in iTunes, mail open, and a few other general miscellanea running). This of course is with the mini outputting to a 23" monitor running at resolution of 2048x1152 pixels and running a secondary HDD (5,400 RPM 500 GB) on top of the primary SSD (so it's tight in there). When the monitor is put to sleep and the system allowed to idle (not sleep, but idle), the temperatures drop to around 41 (after several hours). Depending on the draw to the GPU, your mileage may vary.
 
During load, the temperature rise is much more progressive. The sock paste saw my mini spike in heat compared to the AC5, which sees a much smoother and gradual progression. The fan behaves the same in both cases.
 
One thing to note, when the chip is stressed, the CPU remains hot (about 50-51) for a considerable while, eventually coming back down to it's resting temp of ~45 C. I suspect this has to do with the extreme constraints of the components inside. Creating that much heat must bake the system and while the fan can cool the CPU, the other components will eventually heat up as well. Since a 51 C is actually the running temperature, the fans will not remain at a higher RPM to move the heat away, hence the system remains in that state longer). Again, this is temporary and after about 30 minutes of light use, it will subside.
 
At peak stress, the unit has not pushed past 70 C. The stock compound saw temperatures substantially higher (sometimes in almost 80 C). But I have no yet kept it under sustained load (will update when I reach AC5 thermal efficiency).
 
'''Additional Cooling Strategies'''
 
I should also mention that I've heard a lot about people raising their minis to allow more airflow. I put this to the test. I ran the unit raise 30 mm off the desk. No changes to temperature. So I went a step further and pulled the base off. That saw a 2 C reduction across the board. I went another step further and placed a small fan (blowing around 40 M3/H) aimed upwards. Surprisingly that saw no change in temperatures (above the 2 C from having the base removed). My theory would be that the components are so tightly packed and hidden away from the external fan, that blowing a bit of air on them was insufficient. It might be the case that a large fan would see a reduction to temperatures, but I'm more inclined to think that it would require a replacement of the existing fan with something more powerful (I want to look into this actually).

Estado:

open

Editado por: Tiem ,

Texto:

I pulled apart my mini tonight and re-applied Arctic Silver 5. I have only been up for about 2.5 hours and have yet to produce any thermal cycles, but the temperature is already down a good 6 C from before.
 
The process was utterly painless. For anyone that has taken apart a MBP1,1, you'll know what a joy this model is to work on.
 
For anyone with a modicum of skill, I would say dive in and remove the standard thermal compound. After AC5 has time to reach its full efficacy, I wouldn't be surprised to see an overall 10 C drop across the board. Even know, the 6 C is very much welcome.
 
As I write this, it is sitting at ''steady'' 46 C. Before AC5, it ran anywhere between 51-54C. I must admit I hesitated, but ultimately, I'm glad I did it.
As I write this, it is sitting at ''steady'' 46 C. Before AC5, it ran anywhere between 51-54C. I must admit I hesitated, but ultimately, I'm glad I did it.
 
I must admit'''Preliminary Data (follow up)'''

I've had time to gather some preliminary data and run several heat cycles. It's now been about 120 hours since the application of AC5. I've also kept the ambient temperature outside the unit constant (increased at times actually, which made little difference in all honesty), at ~21 C.

Firstly,
I mulledapplied the paste using the "rice drop" method. I placed a dab in the centre of each diode and squished it over, but ultimately, I'm gladusing the heatsink pads. I did itnot spread it (as is suggested by AC) as that leaves room for thinner points and often results in thermal paste leaking out the sides and acting as an insulator (the opposite of what we want).

The temperatures now generally remain at about 44 to 47 C during general use (surfing the web, playing songs in iTunes, mail open, and a few other general miscellanea running). This of course is with the mini outputting to a 23" monitor running at resolution of 2048x1152 pixels and running a secondary HDD (5,400 RPM 500 GB) on top of the primary SSD (so it's tight in there). When the monitor is put to sleep and the system allowed to idle (not sleep, but idle), the temperatures drop to around 41 (after several hours). Depending on the draw to the GPU, your mileage may vary.

During load, the temperature rise is much more progressive. The sock paste saw my mini spike in heat compared to the AC5, which sees a much smoother and gradual progression. The fan behaves the same in both cases.

One thing to note, when the chip is stressed, the CPU remains hot (about 50-51) for a considerable while, eventually coming back down to it's resting temp of ~45 C. I suspect this has to do with the extreme constraints of the components inside. Creating that much heat must bake the system and while the fan can cool the CPU, the other components will eventually heat up as well. Since a 51 C is actually the running temperature, the fans will not remain at a higher RPM to move the heat away, hence the system remains in that state longer). Again, this is temporary and after about 30 minutes of light use, it will subside.

At peak stress, the unit has not pushed past 70 C. The stock compound saw temperatures substantially higher (sometimes in almost 80 C). But I have no yet kept it under sustained load (will update when I reach AC5 thermal efficiency)
.
I must admit'''Preliminary Data (follow up)'''

I've had time to gather some preliminary data and run several heat cycles. It's now been about 120 hours since the application of AC5. I've also kept the ambient temperature outside the unit constant (increased at times actually, which made little difference in all honesty), at ~21 C.

Firstly,
I mulledapplied the paste using the "rice drop" method. I placed a dab in the centre of each diode and squished it over, but ultimately, I'm gladusing the heatsink pads. I did itnot spread it (as is suggested by AC) as that leaves room for thinner points and often results in thermal paste leaking out the sides and acting as an insulator (the opposite of what we want).

The temperatures now generally remain at about 44 to 47 C during general use (surfing the web, playing songs in iTunes, mail open, and a few other general miscellanea running). This of course is with the mini outputting to a 23" monitor running at resolution of 2048x1152 pixels and running a secondary HDD (5,400 RPM 500 GB) on top of the primary SSD (so it's tight in there). When the monitor is put to sleep and the system allowed to idle (not sleep, but idle), the temperatures drop to around 41 (after several hours). Depending on the draw to the GPU, your mileage may vary.

During load, the temperature rise is much more progressive. The sock paste saw my mini spike in heat compared to the AC5, which sees a much smoother and gradual progression. The fan behaves the same in both cases.

One thing to note, when the chip is stressed, the CPU remains hot (about 50-51) for a considerable while, eventually coming back down to it's resting temp of ~45 C. I suspect this has to do with the extreme constraints of the components inside. Creating that much heat must bake the system and while the fan can cool the CPU, the other components will eventually heat up as well. Since a 51 C is actually the running temperature, the fans will not remain at a higher RPM to move the heat away, hence the system remains in that state longer). Again, this is temporary and after about 30 minutes of light use, it will subside.

At peak stress, the unit has not pushed past 70 C. The stock compound saw temperatures substantially higher (sometimes in almost 80 C). But I have no yet kept it under sustained load (will update when I reach AC5 thermal efficiency)
.

Estado:

open

Original post by: Tiem ,

Texto:

I pulled apart my mini tonight and re-applied Arctic Silver 5. I have only been up for about 2.5 hours and have yet to produce any thermal cycles, but the temperature is already down a good 6 C from before.

The process was utterly painless. For anyone that has taken apart a MBP1,1, you'll know what a joy this model is to work on.

For anyone with a modicum of skill, I would say dive in and remove the standard thermal compound. After AC5 has time to reach its full efficacy, I wouldn't be surprised to see an overall 10 C drop across the board. Even know, the 6 C is very much welcome.

As I write this, it is sitting at ''steady'' 46 C. Before AC5, it ran anywhere between 51-54C.

I must admit I mulled it over, but ultimately, I'm glad I did it.

Estado:

open