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Paso 18
Let us take a look at what silicon is so heavily guarded by the charging case: STMicroelectonics STM32L072 ARM Cortex-M0+ MCU Our X-ray imagery shows some quality issues in this chip's solder joints. Empty spaces, known as voiding, could be evidence of low quality standards, or a rushed product release. Could issues with the AirPod case be what delayed release?
  • Let us take a look at what silicon is so heavily guarded by the charging case:

  • STMicroelectonics STM32L072 ARM Cortex-M0+ MCU

  • Our X-ray imagery shows some quality issues in this chip's solder joints. Empty spaces, known as voiding, could be evidence of low quality standards, or a rushed product release. Could issues with the AirPod case be what delayed release?

  • NXP Semiconductor CBTL1610A3 charging/port controller IC (as seen in iPhones 6s and SE and both iPad Pro models)

  • Texas Instruments BQ24232 power management IC

  • Maxim Integrated MAX9028 1.8 V comparator

  • AMS AS3441 power and communication interface (likely)

  • Probably ON Semiconductor regulators

Echemos un vistazo a lo que el silicio está tan fuertemente protegido por el estuche de carga:

STMicroelectonics STM32L072ARM Cortex-M0+ MCU

Nuestras imágenes de rayos X muestran algunos problemas de calidad en las juntas de soldadura de este chip. Los espacios vacíos, conocidos como anulación, pueden ser evidencia de estándares de baja calidad o de un lanzamiento acelerado del producto. ¿Podrían los problemas con el caso de AirPod ser qué lanzamiento retrasado?

NXP 1610A3 IC de carga (como se ve en los iPhones 6s y SE y en los dos modelos de iPad Pro)

Texas Instruments BQ24232 gestión de energía IC

[* black] Let us take a look at what silicon is so heavily guarded by the charging case:
[* red] STMicroelectonics [http://www.st.com/en/microcontrollers/stm32l0x2.html?querycriteria=productId=LN1844|STM32L072|new_window=true] ARM [https://www.arm.com/products/processors/cortex-m/cortex-m0plus.php|Cortex-M0+|new_window=true] MCU
[* icon_note] Our X-ray imagery shows some quality issues in this chip's solder joints. Empty spaces, known as voiding, could be evidence of low quality standards, or a rushed product release. Could issues with the AirPod case be what delayed release?
[* orange] NXP 1610A3 chargingSemiconductor CBTL1610A3 charging/port controller IC (as seen in iPhones 6s and SE and both iPad Pro models)
[* orange] NXP 1610A3 chargingSemiconductor CBTL1610A3 charging/port controller IC (as seen in iPhones 6s and SE and both iPad Pro models)
[* yellow] Texas Instruments [http://www.ti.com/product/BQ24232?keyMatch=BQ24232&tisearch=Search-EN-Products|BQ24232|new_window=true] power management IC
[* green] Maxim Integrated [link|https://www.maximintegrated.com/en/products/analog/amplifiers/MAX9028.html|MAX9028] 1.8 V comparator
[* light_blue] AMS AS3441 power and communication interface (likely)
[* blue] Probably ON Semiconductor regulators

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