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Aviso: Estás editando una guía de prerrequisito. Cualquier cambio que realices afectará a todas las 22 guías que incluyen este paso.

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Paso 3
Slide the opening pick along the left edge towards the bottom left corner to slice the adhesive. Don't insert the opening pick more than halfway into the phone or you risk damaging internal components. Leave the pick inserted in the bottom left corner to prevent the adhesive from re-sealing.
Begin to slice the adhesive
  • Slide the opening pick along the left edge towards the bottom left corner to slice the adhesive.

  • Don't insert the opening pick more than halfway into the phone or you risk damaging internal components.

  • Leave the pick inserted in the bottom left corner to prevent the adhesive from re-sealing.

Desliza la púa de apertura a lo largo del borde izquierdo hacia la esquina izquierda inferior para cortar el adhesivo.

No insertes la púa de apertura más de la mitad del teléfono o te arriesgas a dañar los componentes internos.

Deja la púa insertada en la esquina inferior izquierda para evitar que el adhesivo vuelva a sellarse.

[title] Begin to slice the adhesive
[* black] Slide the opening pick along the left edge towards the bottom left corner to slice the adhesive.
- [* icon_caution] Do not insert the opening pick more than halfway into the phone or you risk damaging internal components.
+ [* icon_caution] Don't insert the opening pick more than halfway into the phone or you risk damaging internal components.
[* black] Leave the pick inserted in the bottom left corner to prevent the adhesive from re-sealing.

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