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Repara tus cosas

Derecho a reparar

Partes y herramientas

Aviso: Estás editando un prerrequisito para la guía que estabas viendo hace poco. Cualquier cambio que realices afectará todas las 13 guías que incluyan este paso.

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Traduciendo paso 2

Paso 2
Remove the shield plate from the device. A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. For best results, whenever the shield plate is removed, refer to our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro during reassembly. A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. For best results, whenever the shield plate is removed, refer to our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro during reassembly.
  • Remove the shield plate from the device.

  • A thick pink thermal compound bridges the gap between the shield plate and the copper heat sink underneath. For best results, whenever the shield plate is removed, refer to our thermal paste guide to remove the old thermal compound and replace it with an appropriate, thick compound such as K5 Pro during reassembly.

Separa la placa protectora del dispositivo.

Un compuesto adhesivo térmico denso y de color rosado rellena el espacio entre la placa protectora y el disipador de calor cúprico que se encuentra debajo. Usa la guía para aplicar pasta térmica para eliminar los restos antiguos de la misma y sustituirla por una nueva, como por ejemplo de la marca K5 Pro.

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