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Aviso: Estás editando una guía de prerrequisito. Cualquier cambio que realices afectará a todas las 5 guías que incluyen este paso.

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Traduciendo paso 4

Paso 4
Using the plastic opening tool, gently pry the circuit board from the phone. You may need to pry the circuit board in multiple locations to fully loosen it from the phone.
  • Using the plastic opening tool, gently pry the circuit board from the phone.

  • You may need to pry the circuit board in multiple locations to fully loosen it from the phone.

  • The underside of the circuit board is attached to the phone by some black tape. You will not be able to fully remove the circuit board, but you will be able to access the keyboard buttons located on the underside of the circuit board.

  • The partially separated circuit board may be attached to the main button area by factory adhesive/tape. If so, use a soft padded surface to rest the mother board on. Your work area will still be accessible without separating the two units.

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