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Aviso: Estás editando un prerrequisito para la guía que estabas viendo hace poco. Cualquier cambio que realices afectará todas las 4 guías que incluyan este paso.

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Paso 3
Slide the pick along the side of the phone to cut the adhesive securing the rear panel. Go slowly so that the pick doesn't slip out of the seam. If cutting becomes difficult, reheat and reapply the iOpener. Go slowly so that the pick doesn't slip out of the seam. If cutting becomes difficult, reheat and reapply the iOpener.
  • Slide the pick along the side of the phone to cut the adhesive securing the rear panel.

  • Go slowly so that the pick doesn't slip out of the seam. If cutting becomes difficult, reheat and reapply the iOpener.

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