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+[* icon_note] Placeholder for high-res from chipworks.
+[* black] Our friends at Chipworks have spent the last two weeks hard at work cracking the S1. Here's what they found:
+ [* black] The Apple S1 System in Package (SiP) is composed of over 30 individual components, attached to a single board that is then overmolded with a silica or aluminum composite resin—similar to conventional IC packaging, but for an entire board.
+ [* black] At the heart of the S1, Apple's new APL0778 processor is fabbed on Samsung's 28 nm LP process.
+[* black] Check out their full analysis [http://www.chipworks.com/technical-competitive-analysis/resources/blog/inside-the-apple-watch-technical-teardown/#update|here|new_window=true].

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