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-[* icon_note] Placeholder for high-res from chipworks.
[* black] Our friends at Chipworks have spent the last two weeks hard at work cracking the S1. Here's what they found:
[* black] The Apple S1 System in Package (SiP) is composed of over 30 individual components, attached to a single board that is then overmolded with a silica or aluminum composite resin—similar to conventional IC packaging, but for an entire board.
[* black] At the heart of the S1, Apple's new APL0778 processor is fabbed on Samsung's 28 nm LP process.
[* black] Check out their full analysis [|here|new_window=true].

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