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Cambios al paso #12

Editado por Brittany McCrigler

Edicion aprobada por Brittany McCrigler

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[* black] more s1 closeups
[* black] you can make out the part number on this guy, cause it was the one exposed chip
-[* black] this is a better pic of the swirly drug trip section, maybe use this instead of the earlier one.
+[* black] We take a closer look at the flash memory.
+[* black] The flash chip looks flipchiped onto a the substrate with the balls are on the front side. We are taken back by the patterning of the balls because it is so irregular.
+[* black] Looking at the patterning on the chip itself, focusing on the directions of the connections and vias, it looks like this flash is four layers—two signals, power, and ground.
+[* black] Taking a closer look at the balls that connect the chip, we notice a few light-colored bubbles. This is called voiding.
+ [* black] Most contacts between boards are copper. But because copper oxidizes (rusts) very quickly, you have to wash it with an acid before you make the bond. This acid is called flux and is used to "wet" the tin solder. Voiding happens when the flux isn't completely cleaned off.
+ [* black] What's worse is it is bad for durability. Clean, even connections allow heat to dissipate and [http://creative.creativeelectron.netdna-cdn.com/wp-content/uploads/2014/10/EconomicsofLEDVoiding.compressed.pdf|voiding allow for heat build up, thus reducing the life of components.|new_window=true]