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Cambios al paso #10

Editado por Andrew Optimus Goldheart

Edicion aprobada por Andrew Optimus Goldheart

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-[* black] the s1!
-[* black] and some closeups, if we have anything to say about those?
-[* black] Most of the S1 is wire bonding onto the board from flexible circuit—which is why they encapsulated it in resin—no solder, minimal stability.
- [* black] Wire bonds are typically 10-17 microns, very small, very fragile.
- [* black] This saves space, as soldered packages will be thicker, but requires a whole new type of manufacturing.
+[* black] And here it is. The [http://en.wikipedia.org/wiki/Apple_S1|Apple S1|new_window=true] computer-on-chip. Where we were earlier thwarted, we've got a better look with some interesting analysis.
+ [* black] By encasing the S1 in resin, Apple was able to make use of wire bonding to make many of the connections between chips in PoP stacks. These are incredibly small bonds, typically 10-17 microns.
+ [* black] This saves space, as soldered packages would be thicker, but requires a whole new level of manufacturing expertise.