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Editado por Mariana

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[* black] Todo este pegamento nos ha cansado. Sentémonos a observar algunos chips:
[* red] Micron 8JE77G9WGH 4 GB LPDDR4X DRAM sobre Qualcomm Snapdragon 845
[* orange] Almacenamiento de flash universal 64 GB Skhynix [https://www.skhynix.com/eng/product/nandUFS.jsp|H28S7Q302BMR]
[* yellow] Núcleo visual Google [https://blog.google/products/pixel/pixel-visual-core-image-processing-and-machine-learning-pixel-2/|SR3HX] Pixel (como en el [https://es.ifixit.com/Desmontaje/Google+Pixel+2+XL+Teardown/98093#s180076|Pixel 2 XL])
[* green] Transceptor RF Qualcomm SDR845
[* light_blue] Qualcomm QPM2622 y QPM2642
[* blue] Rastreo envolvente Qualcomm [https://www.qualcomm.com/news/releases/2016/02/17/qualcomm-technologies-announces-next-generation-qualcomm-rf360-front-end|QET4100]40MHz
[* violet] Qualcomm [http://www.eenewspower.com/news/adaptive-power-management-added-mobile-chipset|PMI8998] PMIC