Introducción

The adhesive white film is attached to the faceplate of the phone. Removal of this component is necessary to provide access to several underlying components. Removal of the film is simple and requires minimal tools and no prior experience.

Partes

No se requieren partes.

Locate the small button on the top of the phone.
  • Locate the small button on the top of the phone.

  • Depress the button.

  • With your other hand, pull the front cover away from the phone.

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Remove all six 5.3 mm long T6 screws.
  • Remove all six 5.3 mm long T6 screws.

  • Remove the circuit board/faceplate sub-assembly from the back of the phone.

  • Take care to place screws in a safe location.

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  • Using your fingers, pull the small plastic tab away from the circuit board/faceplate sub-assembly.

  • Rotate the faceplate away from the circuit board.

  • Gently remove the faceplate from the circuit board, taking care to not break the small plastic tab on the other side of the sub-assembly.

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  • Hold the faceplate with the adhesive film facing upwards.

  • Use the spudger to pry the adhesive film away. This can be done by working the tool back and forth underneath the film.

  • It is easiest to begin in the upper left corner.

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  • Continue to loosen the film with the spudger.

  • Once the film has been mostly loosened, you can peel away the film.

  • Once the film has been removed, the microphone may fall out, if so, place it aside until all other repairs are finished.

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Conclusión

To reassemble your device, follow these instructions in reverse order.

Equipo

Clemson, Team 15-3, Benson Fall 2012 Miembro de Clemson, Team 15-3, Benson Fall 2012

CLEM-BENSON-F12S15G3

3 Miembros

21 Guías creadas

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