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Partes y herramientas

Introducción

Use this guide if you are looking to gain access to the LG Risio Motherboard or other components inside the device.

Partes

No se especificaron partes.

  1. Use a plastic opening tool to seperate the back panel from the device. Remove the back panel.
    • Use a plastic opening tool to seperate the back panel from the device.

    • Remove the back panel.

  2. Place your thumb along the bottom of the battery and pry upwards to remove.
    • Place your thumb along the bottom of the battery and pry upwards to remove.

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  4. Press down on the SIM eject tab with a fingernail (or iFixit opening tool), and slide the SIM card out.
    • Press down on the SIM eject tab with a fingernail (or iFixit opening tool), and slide the SIM card out.

  5. Remove the eight Phillips #0 screws from the internal support frame. Remove the eight Phillips #0 screws from the internal support frame.
    • Remove the eight Phillips #0 screws from the internal support frame.

  6. Use an opening tool on the marked locations to lift the edges up. There should be a small click when lifting these edges up. Use an opening tool on the marked locations to lift the edges up. There should be a small click when lifting these edges up. Use an opening tool on the marked locations to lift the edges up. There should be a small click when lifting these edges up.
    • Use an opening tool on the marked locations to lift the edges up. There should be a small click when lifting these edges up.

  7. Using your hand, pick up the midframe to  separate it from the phone.
    • Using your hand, pick up the midframe to separate it from the phone.

    • If the midframe does not want to lift off, go back and repeat step 6.

Conclusión

To reassemble your device, follow these instructions in reverse order.

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