This is a Blink Mini 2K+ Indoor/Outdoor security camera. It retails for $39.99 down to $25.99 as of 2026, and has decent quality for its price. It also is IP-65 water resistant against rain.

It features night-vision capabilities, 2K video quality, AI smart detection, noice cancellation, and much more.

It also is quite small too, I expect very small chips across multiple crammed PCB’s.

You do also have to download an app with the camera, which still works without a subscription, but doesn’t have full AI and cloud software features unless you purchase the full subscription plan.

To begin disassembly of your camera, use some tweezers or a toothpick to slowly push out the small rubber inserts covering the two screws.

Use a long Philips head screwdriver to unscrew the 2 screws. Make sure to keep track of both the screws and rubber inserts as they are quite small, and easy to loose.

Once both screws are removed, use an opening pick/flathead, or something that can wedge in between the case of the camera.

There is an O-ring gasket in between the two sides of the case. Make sure it stays on the front part to ensure it’s IP-65 water resistant rating if you do reassemble this camera.

As expected the PCBA module and camera is very tightly compacted…

I will remove the RF shields, but not the actual camera to see the CMOS sensor, as I want to put this back together.

To start removal of the PCB module, disconnect the ribbon cable connecting the main board to the sensors underneath the secondary board below the main board.

After removing the ribbon/flex cable, gently pull up on the PCB to separate it from the bottom PCB.

The two PCB’s are connected by a large connector and the flex cable that has already been removed.

Remove the two black Philips screws holding the second PCB for Bluetooth connectivity. Next, you can lift it up, and out of the front case of the camera.

(Yes, I will remove the RF shields…)

Under the RF shields, the Main processor powering this little camera is an Immedia (Amazon acquired company) SoC in a BGA format, allowing for such a small space. I can’t find that much info on it, but here are some images of it. The numbers are small and poorly imprinted. My camera doesn’t help this at all either.

The other chip has no branding on it, as it is in the CSP wafer-scale packaging type to maximize space. I believe that it is responsible for Bluetooth connectivity and interaction/transmission, with the main device the camera is broadcasting footage to.

Thanks for viewing.